MIL-T-21451(NOrd)
3.1.3 Preproduction sample. - Unless otherwise specified
in the contract or order, a preproduction sample shall be
manufactured by the same procedures and processes and at the
same location as proposed for full production. This sample
will be tested for the purpose of determining compliance with
3.1.4 Interchangeability. - Component parts of assembled
units (unless otherwise specified on the applicable drawings)
fabricated in strict agreement with their applicable drawings,
shall be interchangeable and shall assemble with mating com-
ponents of the unit without selection or fitting. If, during
assembly of the fabricated parts of a unit, selection or fitt-
ing is required and changes in dimensions are necessary, no
changes in the parts as delineated on applicable drawings
shall be made without prior approval of the Bureau of Ordnance.
3.2 Moisture-and fungus-resistant treatment. - Materials
and parts of this test set which are not moisture and fungus
resistant shall be treated, before assembly, with a varnish
conforming to Military Specification MIL-V-173.
3.3 Requests for deviation. - Requests for deviation
from this specification, applicable drawings, specifications
publications, materials and processes specified herein, shall
be as set forth in OP 400.
3.4 Conflicting requirements. - Conflicting requirements
arising between this specification or any specifications, pub-
lications, or drawings listed herein, shall be referred in
writing to the procuring agency or appointed agent for inter-
pretation and clarification.
3.5 Soldering. - Unless otherwise specified, soldering
processes shall conform to the requirements specified in
Military Specification MIL-S-6872. Only non-corrosive and
non-volatile fluxes shall be used. Rosin shall be used when
soldering wires to contacts and terminals. The use of rosin
core solder is permitted. Electrical connections shall be
mechanically secure and electrically continuous before solder-
ing. Sufficient heat shall be applied during the soldering
process to avoid "cold" solder joints.
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